About This Event

Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus 

Abbreviation: ICICM 2021

Time: October 22-24, 2021

Place: Nanjing,China

Website: http://www.icicm.net/

(For early submission, it will get the feedback within 1 month)

Publication: Conference Proceeding

Indexed by: Ei Compendex, and Scopus, etc.

Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)

Find the template with the link: http://icicm.net/files/Template.doc

Co-sponsored by

University of Electronic Science and Technology of China, China

Technology of China and Southeast University, China

ICICM Committees

• Advisory Chairs  
  • David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)
  • Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)
• Conference Chairs  
  • Zhigong Wang, Southeast University, China
  • Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)
• Program Chairs  
  • Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)
  • Zou Zhuo, Fudan University, China(Senior Member of IEEE)
  • Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden   
• Steering Committee Chair
  • Huang Le Tian, University of Electronic Science and Technology of China, China
• Technical Committee
  • Zhenhai Chen, Hefei University of Technology, China
  • Junji Cheng, University of Electronic Science and Technology of China, China
  • Pan Dai, Huzhou University, China
  • Quanzhen Duan, Tianjin University of Technology, China
  • Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia
  • Shengming Huang, Tianjin University of Technology, China
  • Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan
  • Xiangliang Jin, Hunan Normal University, China
  • Biba Josef, Universität der Bundeswehr München, Germany
  • Atsushi Kurokawa, Hirosaki University, Japan 
  • Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan
  • Qi Li, Guilin University of Electronic Technology, China
  • Weiguang Sheng, Shanghai Jiao Tong University, China
  • Chunyi Song, Zhejiang University, China 
  • Haizhi Song, University of Electronic Science and Technology of China, China
  • Jiajia Sun, China Academy of Space Technology, China
  • Lu Tang, Southeast University, China
  • Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand
  • Wensi Wang, Beijing University of Technology, China
  • Weilin Xu, Guilin University of Electronic Technology, China
  • Jong-Ryul Yang, Yeungnam University, South Korea
  • Changchun Zhang, Nanjing University of Posts and Telecommunications, China 

For more members, please visite conference website: http://www.icicm.net/committee.html

History

• <ICICM2020 | IEEE Publisher | Nanjing,China | October 23-25, 2020>
  • Papers of ICICM2020 can be checked in IEEE Xplore!
  • Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2
• <ICICM2019 | IEEE Publisher | Beijing, China | October 25-27, 2019>
  • Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1
• <ICICM2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>
  • Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5
• <ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> 
  • Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0
• <ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
  • Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

Topics

• Digital, Analog, Mixed Signal IC and SOC design technology
• Silicon integrated circuits and manufacturing
• Low-power, RF devices & circuits
• IC Computer-Aided –Design technology, DFM
• Silicon/germanium devices and device physics
• Interconnect, Low K, High K and other process technologies
• Unconventional and nano-electronics
• Organic semiconductor devices and technologies
• Compound semiconductor devices and circuits
• Displays, sensors and MEMS
• Semiconductor materials and material characterization
• Packaging and testing technology
• Solar cell & other devices for new energy sources
• Modeling and simulation
• Equipment technology
• Reliability
• Displays, sensors and MEMS
• Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)

Conference Contact

• Ms Zeng
• Email: icicm@young.ac.cn
• Tel: +86-28-87777577
• Web: www.icicm.net